Los Angeles, CA -- (SBWIRE) -- 10/09/2018 -- This study focuses on the production side and consumption side of Solder Ball, presents the global Solder Ball market size by manufacturers, regions, type and application, history breakdown data from 2013 to 2018, and forecast to 2025.

In terms of production side, this report researches the Solder Ball capacity, production, value, ex-factory price, growth rate, market share for major manufacturers, regions (or countries) and product type.

In terms of consumption side, this report focuses on the consumption of Solder Ball by regions and application. The key regions like North America, Europe, Asia-Pacific, Central & South America, Middle East and Africa etc.

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.

The Solder Ball market was valued at 210 Million US$ in 2017 and is projected to reach 350 Million US$ by 2025, at a CAGR of 6.4% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Solder Ball.

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This report includes the following manufacturers; we can also add the other companies as you want.

Senju Metal

DS HiMetal

MKE

YCTC

Nippon Micrometal

Accurus

PMTC

Shanghai hiking solder material

Shenmao Technology

Market Segment by Product Type

Lead Solder Ball

Lead Free Solder Ball

Market Segment by Application

BGA

CSP & WLCSP

Flip-Chip & Others

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