MarketResearchReports.Biz announces addition of new report “China Semiconductor Equipment Industry, Trends and Forecast Report 2013 - 2014” to its database.

Albany, NY -- (ReleaseWire) -- 01/29/2014 --After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it witnessed a drop by 15.2% in 2012 and a further decline by 8.1% in 2013. The reduction came mainly as the steep decrease of backlog orders from North America and South Korea. Notably, the contracted orders from North America resulted largely from the glooming PC market and Intel’s reduction of capital expenditure for equipment, while the shrinkage of orders from South Korea was heavily duel to the suspension of investment in DRAM.

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In 2014, the driving force of the semiconductor equipment market is mainly sourced from foundry and memory. In particular, foundry began to step into 20nm domain, while memory is ushering in 3D era. In the era of 20nm, semiconductor vendors employ two routes: double/multiple patterning and EUV. Double/multiple patterning is more technologically advanced than EUV, although it means substantial cost rise in manufacturing and equipments, especially for etching equipments.

EUV can cut the manufacturing and equipments cost significantly, albeit EUV itself costs as high as USD100 million. But counted by the total cost, 14nm wafer equipped with EUV technology is roughly 40% lower than that equipped with multiple patterning technology. However, there are many hurdles for EUV remained to be addressed. One of them is light source. Multiple e-beam direct write is well low-efficiency, thus failing to meet the standard for practical use.

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Table of Content

1 Global Semiconductor Industry
1.1Overview
1.2 DRAM Memory Industry
1.2.1 Status Quo
1.2.2 Market Share of DRAM Memory Vendors
1.2.3 Market Share of Mobile DRAM Memory Vendors
1.3 NAND Flash Memory
1.4 IC Fabrication and Wafer Foundry
1.5 Overview of IC Packaging and Testing Industry

2 Semiconductor Equipment Industry
2.1 Semiconductor Equipment Market
2.2 Etching Equipment Industry
2.3 Thin Film Deposition Equipment Industry
2.4 Lithography Equipment Industry
2.5 EUV or Multiple Patterning for the Next Generation
2.6 Semiconductor Process Control Equipment
2.7 Compound Semiconductor Equipment Market

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3 Major Semiconductor Equipment Vendors
3.1 Applied Materials
3.2 ASML
3.3 Tokyo Electron
3.4 KLA-Tencor
3.5 Lam Research
3.6 DAINIPPON SCREEN
3.7 Nikon Precision

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