Molded Interconnect Device (MID) Market Revenue $2.7 Billion by 2027
The molded interconnect device(MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027; it is expected to grow at a CAGR of 13.6% during the forecast period. Major factors driving the growth of molded interconnect device(MID) market are expected to be driven by the rising application in consumer electronics. Likewise, with technological advancement in automotive sector has increased significantly, creating lucrative opportunities for the market players.
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